Aktueller Newsletter (klingt ja ganz nett):Corsair Announces Availability of 512Megabyte
XMS3000 and XMS3200 DDR DIMMs
Fremont, CA, April 24, 2002: Corsair Memory, Inc., an industry leader in
ultra-performance DDR DRAM modules for gaming and overclocking applications, has
announced that it is now offering two new 512 megabyte modules tailored
specifically for overclocking applications. The first part, Corsair part number
CMX512-3200, is guaranteed to operate at 400 MHz. The second part, part number
CMX512-3000C2, is guaranteed to operate at 370 MHz, but with a column access
strobe latency ("CAS latency") of only two clock cycles.
"Most users of Corsair's memory like to put at least 512 megabytes of memory
into their systems," stated Don Lieberman, Corsair's Vice President of
Engineering. "We believe that these modules offer our customers the ability to
hit the highest speeds possible. One 512 megabyte module will outperform two 256
megabyte modules built with the same type of components in nearly any given
performance-oriented system."
Each CMX512-3200 is tested in a test fixture based on a currently popular
motherboard based on a performance chip set such as Via's KT333 Athlon or SiS'
645 Pentium IV platform. The testing rig is set to exhaustively exercise the
memory at the following settings:
Memory bus speed: 2x200 MHz
CAS latency: 2.5 clock cycles
RAS precharge: 3 cycles
RAS-to-CAS delay: 3 cycles
RAS active to precharge: 6 cycles
Command rate: 2T (2 cycles)
Population: 1 module/system
The CMX512-3000C2 is built using the same components as the CMX512-3200, and
will provide the user with very similar performance. However, it is tested with
more aggressive latency settings, as many customers prefer to configure their
systems that way. The CMX512-3000C2 is tested using the following settings:
Memory bus speed: 2x185 MHz
CAS latency: 2.0 clock cycles
RAS precharge: 3 cycles
RAS-to-CAS delay: 3 cycles
RAS active to precharge: 6 cycles
Command rate: 1T (1 cycle)
Population: 1 module/system
Corsair's lab testing results also indicate that the modules will also easily
meet two critical performance points. The first of these is ultra-low latency
(2-2-2-5-T1) at 2x166 (333) MHz, a setting used by enthusiasts who optimize
their performance based on low latency settings. The second is ultra-high
density (2.5-3-3-6-T2, 2x185 MHz) with two modules (1 gigabyte) of memory
installed in the system, a typical requirement for users performing scientific
and modeling applications
Corsair's 512 MByte XMS3200 and XMS3000 modules utilize 32Mx8 RAMs which have
been carefully screened to meet these demanding performance requirements. The
modules have been extensively qualified in motherboards based on chip sets from
Via Technologies and Silicon Integrated Systems (SiS) that are capable of
supporting the required high-speed memory bus. The modules are shipped with a
pre-installed aluminum heat spreader. Details on Corsair's XMS qualification and
testing can be found on Corsair's web site, at
http://www.corsairmemory.com/main/ttrg-xms.html. Both modules are available immediately.
Further information and specifications on this product and other XMS products
can be found at Corsair's web site (
http://www.corsairmemory.com). These modules can
be purchased through Corsair’s authorized sales channels listed at
http://www.corsairmemory.com/main/howtobuy.htm About Corsair Memory
Corsair Memory, a member of JEDEC, has been a leader in the design and
manufacture of high speed modules since 1994. We have earned our reputation as
being the first to market with leading-edge products supporting new computing
platforms and technologies. Corsair supplies memory for applications ranging
from mission-critical servers to ultra-high performance gaming systems. The
performance and reliability of Corsair memory products makes them ideal for the
high bandwidth internet infrastructure.
More information on Corsair is available at
http://www.corsairmemory.com. Contact Information:
John Beekley
Corsair Memory Inc.
510-657-8747
protected
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